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汇丰科技2025秋季实习生招聘启动!
Post Time:2024-11-14 Deadline:2024-12-30

Company name:汇丰科技

Countries & Regions:No requirement

Work Type:Internship

Position Type:Others

Number Of Vacancy:Several

Salary Range:face to face

Job Description

【实习生招募令】 汇丰科技2025秋季实习生招聘启动! 

岗位:实习软件工程师 

地点:广州&西安

截止日期:12月30日

投递链接:https://www.hsbc.com/careers/students-and-graduates/student-opportunities/technology-internship-engineering 

加入我们,开启科技职业生涯! 

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